Hybrid low dielectric constant thin films for microelectronics
- Willi Volksen
- Krystelle Lionti
- et al.
- 2014
- Scripta Materialia
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66 results for Geraud Dubois
Independent control of adhesive and bulk properties of hybrid silica coatings on polycarbonate
- Krystelle Lionti
- Linying Cui
- et al.
- 2013
- ACS AMI
Heterogeneous solution deposition of high-performance adhesive hybrid films
- Marta Giachino
- Geraud Dubois
- et al.
- 2013
- ACS AMI
Improved adhesion of dense silica coatings on polymers by atmospheric plasma pretreatment
- Linying Cui
- Alpana N. Ranade
- et al.
- 2013
- ACS AMI
Investigation of plasma etch damage to porous oxycarbosilane ultra low-k dielectric
- Robert Bruce
- Sebastian Engelmann
- et al.
- 2013
- Journal of Physics D: Applied Physics
Enhanced desalination performance of polyamide bi-layer membranes prepared by sequential interfacial polymerization
- Young-Hye La
- Jacquana Diep
- et al.
- 2013
- Journal of Membrane Science
Impact of low-k structure and porosity on etch processes
- Maxime Darnon
- Nicolas Casiez
- et al.
- 2012
- Journal of Vacuum Science and Technology B:Nanotechnology and Microelectronics
Moisture-insensitive polycarbosilane films with superior mechanical properties
- Y. Matsuda
- J.S. Rathore
- et al.
- 2012
- ACS AMI
Post porosity plasma protection: Scaling of efficiency with porosity
- Theo Frot
- Willi Volksen
- et al.
- 2012
- Advanced Functional Materials
A Manufacturing grade, porous oxycarbosilane spin-on dielectric candidate with K 2.0
- Willi Volksen
- Teddie P. Magbitang
- et al.
- 2011
- JES