Electrodeposition of Cu on Ta-based layer II: Cu Electrodeposition on Cu/Ta bilayers
- J. Kelly
- M. Zheng
- et al.
- 2007
- JES
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162 results for Cyril Cabral
Interfacial microstructure of NiSix/HfO2/SiOx/Si gate stacks
- M. Gribelyuk
- C. Cabral Jr.
- et al.
- 2007
- Thin Solid Films
Evidence for segregation of Te in Ge2 Sb2 Te5 films: Effect on the "phase-change" stress
- L. Krusin-Elbaum
- C. Cabral
- et al.
- 2007
- Applied Physics Letters
Irreversible modification of Ge2Sb2Te5 phase change material by nanometer-thin Ti adhesion layers in a device-compatible stack
- C. Cabral Jr.
- K.N. Chen
- et al.
- 2007
- Applied Physics Letters
Alpha particle mitigation strategies to reduce chip soft error upsets
- C. Cabral
- K.P. Rodbell
- et al.
- 2007
- Journal of Applied Physics
Effects of additive elements on the phase formation and morphological stability of nickel monosilicide films
- C. Lavoie
- C. Detavernier
- et al.
- 2006
- Microelectronic Engineering
On the use of alloying elements for Cu interconnect applications
- K. Barmak
- C. Cabral
- et al.
- 2006
- Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Aluminum mobility and interfacial segregation in fully silicided gate contacts
- R.P. Pezzi
- M. Copel
- et al.
- 2005
- Applied Physics Letters
Interfacial segregation of dopants in fully silicided metal-oxide- semiconductor gates
- M. Copel
- R.P. Pezzi
- et al.
- 2005
- Applied Physics Letters
Physical and electrical analysis of Rux Yy alloys for gate electrode applications
- Bei Chen
- Youseok Suh
- et al.
- 2005
- Applied Physics Letters