Resistive Random Access Memory Filament Visualization and Characterization Using Photon Emission Microscopy
- Franco Stellari
- Ernest Y. Wu
- et al.
- 2021
- IEEE Electron Device Letters
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162 results for Cyril Cabral
3-D Die Stacking with 55 μm Pitch Interconnections on Advanced Ground-Rule Laminate for Artificial Intelligence System
- Katsuyuki Sakuma
- Mukta Farooq
- et al.
- 2021
- IEEE Transactions on CPMT
Dust-Sized High-Power-Density Photovoltaic Cells on Si and SOI Substrates for Wafer-Level-Packaged Small Edge Computers
- Ning Li
- Kevin Han
- et al.
- 2020
- Advanced Materials
Thin film deposition research and its impact on microelectronics scaling
- Cyril Cabral
- Christian Lavoie
- et al.
- 2020
- JVSTA
AC conductivity analysis as a measure of low k dielectric capacitor reliability degradation due to moisture ingress
- Cyril Cabral
- Robert B. Laibowitz
- et al.
- 2020
- Microelectronic Engineering
Humidity Penetration Impact on Integrated Circuit Performance and Reliability
- Franco Stellari
- Cyril Cabral
- et al.
- 2019
- IEDM 2019
Crypto anchors
- Venkat Balagurusamy
- Cyril Cabral
- et al.
- 2019
- IBM J. Res. Dev
Mechanisms of Electromigration Damage in Cu Interconnects
- C. K. Hu
- Lynne Gignac
- et al.
- 2018
- IEDM 2018
Column Interconnects: A Path Forward for Embedded Cooling of High Power 3D Chip Stacks
- Mark D. Schultz
- Cyril Cabral
- et al.
- 2018
- ECTC 2018
Prediction of recrystallization times in electroplated copper thin films
- Mikhail Treger
- C. Witt
- et al.
- 2016
- Thin Solid Films