3-D Die Stacking with 55 μm Pitch Interconnections on Advanced Ground-Rule Laminate for Artificial Intelligence System
- Katsuyuki Sakuma
- Mukta Farooq
- et al.
- 2021
- IEEE Transactions on CPMT
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55 results for Paul Andry
Injection of Molten Solder (IMS) Technology for Solder Bumping on Wafers, Ceramic/Organic/Flexible Substrates, and Si Via Filling from Fine Pitch to Large Pitch
- Jae Woong Nah
- Li-Wen Hung
- et al.
- 2018
- ECTC 2018
Column Interconnects: A Path Forward for Embedded Cooling of High Power 3D Chip Stacks
- Mark D. Schultz
- Cyril Cabral
- et al.
- 2018
- ECTC 2018
Feasibility Study of Si Handler Debonding by Laser Release
- Bing Dang
- Thomas Wassick
- et al.
- 2016
- ECTC 2016
An 82%-efficient multiphase voltage-regulator 3D interposer with on-chip magnetic inductors
- Kevin Tien
- Noah Sturcken
- et al.
- 2015
- VLSI Circuits 2015
An 82%-efficient multiphase voltage-regulator 3D interposer with on-chip magnetic inductors
- Kevin Tien
- Noah Sturcken
- et al.
- 2015
- VLSI Technology 2015
Simulation of thermal pulse evolution during laser debonding
- Bucknell Webb
- Paul Andry
- 2015
- ECTC 2015
Advanced wafer bonding and laser debonding
- Paul Andry
- Russell A. Budd
- et al.
- 2014
- ECTC 2014
Factors in the selection of temporary wafer handlers for 3D/2.5D integration
- Bing Dang
- Bucknell Webb
- et al.
- 2014
- ECTC 2014
Transferrable fine pitch probe technology
- Y. Liu
- S.L. Wright
- et al.
- 2014
- ECTC 2014