Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection
- John U. Knickerbocker
- Paul S. Andry
- et al.
- 2005
- IBM J. Res. Dev
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55 results for Paul Andry
Floating-island TFT leakage caused by process step reduction
- Takatoshi Tsujimura
- Osamu Tokuhiro
- et al.
- 2002
- IEEE Transactions on Electron Devices
Atomic-beam alignment of inorganic materials for liquid-crystal displays
- P. Chaudhari
- James Lacey
- et al.
- 2001
- Nature
Dry vertical alignment method for multi-domain homeotropic thin-film-transistor liquid crystal displays
- C. Cai
- Alan Lien
- et al.
- 2001
- Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers
High-dielectric constant insulators and the AMLCD process: is amorphous BST a candidate?
- P. Andry
- D.A. Neumayer
- et al.
- 1999
- MRS Spring Meeting 1999