Effect of Ag and Cu content in Sn based Pb-free solder on electromigration
- Minhua Lu
- Charles Goldsmith
- et al.
- 2014
- ECTC 2014
Publications
Date
Featured collections
Popular topics
21 results for Charles Goldsmith
The effects of Ag, Cu compositions and Zn doping on the electromigration performance of pb-free solders
- Minhua Lu
- Da-Yuan Shih
- et al.
- 2009
- ECTC 2009
Comparison of electromigration performance for Pb-free solders and surface finishes with Ni UBM
- Minhua Lu
- Paul Lauro
- et al.
- 2008
- ECTC 2008
Evaluation of thermal fatigue life and failure mechanisms of Sn-Ag-Cu solder joints with reduced Ag contents
- Sung K. Kang
- Paul Lauro
- et al.
- 2004
- ECTC 2004
Formation of Ag3Sn plates in Sn-Ag-Cu alloys and optimization of their alloy composition
- Sung K. Kang
- Won Kyoung Choi
- et al.
- 2003
- ECTC 2003
Interfacial reaction studies on lead (Pb)-free solder alloys
- S.K. Kang
- D.Y. Shih
- et al.
- 2001
- ECTC 2001
Study of interfacial reaction and electromigration reliability of Pb-free solders with nickel iron barrier layer
- Minhua Lu
- Paul Lauro
- et al.
- 2011
- InterPACK 2011
Residual stress properties of nickel and copper deposits used for C4 interconnects
- Charles Arvin
- G.J. Scott
- et al.
- 2011
- ECS Meeting 2011
Comparison of electromigration behaviors of SnAg and SnCu solders
- Minhua Lu
- Da-Yuan Shih
- et al.
- 2009
- IRPS 2009
Immersion plating of bismuth on tin-based alloys to stabilize lead-free solders
- Emanuel I. Cooper
- Charles C. Goldsmith
- et al.
- 2004
- ECS Meeting 2004