Integration of intra chip stack fluidic cooling using thin-layer solder bonding
- Yassir Madhour
- Michael Zervas
- et al.
- 2013
- 3DIC 2013
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19 results for John R. Thome
STEAM: A fast compact thermal model for two-phase cooling of integrated circuits
- Arvind Sridhar
- Yassir Madhour
- et al.
- 2013
- ICCAD 2013
Patterned die-to-die thin film bonding for 3D chip stacks with integrated microfluidic cooling
- Yassir Madhour
- Thomas Brunschwiler
- et al.
- 2012
- ICEPT 2012
Cooling of next generation computer chips: Parametric study for single- and two-phase cooling
- Yassir Madhour
- Severin Zimmermann
- et al.
- 2011
- THERMINIC 2011
Experimental adiabatic two-phase pressure drops of R134a, R236fa and R245fa in small horizontal circular channels
- Chin L. Ong
- John R. Thome
- 2011
- AJTEC 2011
Two-phase flow boiling of R134a in a multimicrochannel heat sink for microprocessor cooling
- Yassir Madhour
- Jonathan Olivier
- et al.
- 2010
- THERMINIC 2010
Hot-spot self-cooling effects on two-phase flow of R245fa in 85μm-wide multi-microchannels
- Etienne Costa-Patry
- Jonathan Olivier
- et al.
- 2010
- THERMINIC 2010
Effect of inlet orifice on saturated CHF and flow visualization in multi-microchannel heat sinks
- Jung Eung Park
- John R. Thome
- et al.
- 2009
- SEMI-THERM 2009
Modeling of two-phase evaporative heat transfer in three-dimensional multicavity high performance microprocessor chip stacks
- Yassir Madhour
- Brian P. D'Entremont
- et al.
- 2014
- ASME Journal of Electronic Packaging
Dynamic flow control and performance comparison of different concepts of two-phase on-chip cooling cycles
- Jackson Braz Marcinichen
- Duan Wu
- et al.
- 2014
- Applied Energy