Thermal cycle reliability of stacked via structures with copper metallization and an organic low-k dielectric
- R. Filippi
- J.F. McGrath
- et al.
- 2004
- IRPS 2004
Publications
Date
Featured collections
Popular topics
38 results for M.W. Lane
Interfacial relationships in microelectronic devices
- Michael Lane
- Robert Rosenberg
- 2003
- MRS Proceedings 2003
Relationship between interfacial adhesion and electromigration in Cu metallization
- J.R. Lloyd
- M.W. Lane
- et al.
- 2002
- IIRW 2002
Corrosion in low dielectric constant Si-O based thin films: Buffer concentration effects
- F.W. Zeng
- Stephen M. Gates
- et al.
- 2014
- AIP Advances
Corrosion of Si-O based porous low-k dielectrics
- A.B. Hall
- G.J. Irvine
- et al.
- 2012
- Applied Physics Letters
Effects of silylation on fracture and mechanical properties of mesoporous silica films interfaced with copper
- D.D. Gandhi
- B. Singh
- et al.
- 2009
- Journal of Applied Physics
Pore orientation and silylation effects on mesoporous silica film properties
- A.P. Singh
- D.D. Gandhi
- et al.
- 2009
- Applied Physics Letters
Interface engineering for high interfacial strength between SiCOH and porous SiCOH interconnect dielectrics and diffusion caps
- A. Grill
- D. Edelstein
- et al.
- 2008
- Journal of Applied Physics
Copper diffusion and mechanical toughness at Cu-silica interfaces glued with polyelectrolyte nanolayers
- D.D. Gandhi
- A.P. Singh
- et al.
- 2007
- Journal of Applied Physics
Delamination in patterned films
- X.-H. Liu
- M.W. Lane
- et al.
- 2007
- Int. J. Solids Struct.