Modeling of switching noise and coupling in multiple chips of 3D TSV-based systems
- Huanyu He
- Xiaoxiong Gu
- et al.
- 2014
- ECTC 2014
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11 results for Jian-Qiang Lu
Power delivery modeling for 3D systems with non-uniform TSV distribution
- Huanyu He
- Zheng Xu
- et al.
- 2013
- ECTC 2013
Multiple voltage-supplies in TSV-based three-dimensional (3D) power distribution networks
- Zheng Xu
- Xiaoxiong Gu
- et al.
- 2012
- ECTC 2012
Electromagnetic-SPICE modeling and analysis of 3D power network
- Zheng Xu
- Jian-Qiang Lu
- et al.
- 2011
- ECTC 2011
Structure, design and process control for Cu bonded interconnects in 3D integrated circuits
- Kuan-Neng Chen
- Sang Hwui Lee
- et al.
- 2006
- IEDM 2006
Cu-based bonding technology for 3D integration applications
- K.N. Chen
- Zheng Xu
- et al.
- 2012
- 3DIC 2012
Parasitics extraction, wideband modeling and sensitivity analysis of through-strata-via (TSV) in 3D integration/packaging
- Zheng Xu
- Xiaoxiong Gu
- et al.
- 2011
- ASMC 2011
Investigations of Cu bond structures and demonstration of a wafer-level 3D integration scheme with W TSVs
- K.N. Chen
- Cyril Cabral Jr.
- et al.
- 2010
- VLSI-TSA 2010
Improved manufacturability of Cu bond pads and implementation of seal design in 3D integrated circuits and packages
- K.N. Chen
- C. Tsang
- et al.
- 2006
- VMIC 2006
Fabrication of nano-scale Cu bond pads with seal design in 3D integration applications
- K.N. Chen
- Cornelia Tsang
- et al.
- 2011
- Journal of Nanoscience and Nanotechnology