Application of Cu Reflow Process on Ru Liner for Advanced Nanoscale Interconnects
- K. Motoyama
- O. van der Straten
- 2024
- ECS J. Solid State Sci. Technol.
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33 results for O. Van Der Straten
Evaluation of Cu surface diffusion on different metal liner materials for Cu reflow applications
- O. van der Straten
- L.W. Wangoh
- 2024
- Journal of Materials Research
Evaluation of different metal preclean conditions for MOL for 2nm and beyond: Topic/category: AEPM : nt Processes and Materials
- Samuel Munnangi
- Andrew Simon
- et al.
- 2024
- ASMC 2024
Process and Tool Monitoring Strategy for Advanced Magnetic Tunnel Junction Stack Deposition
- Gabriel Rodriguez
- Oscar Van Der Straten
- et al.
- 2024
- ASMC 2024
Material to system-level benchmarking of CMOS-integrated RRAM with ultra-fast switching for low power on-chip learning
- Minhaz Abedin
- Nanbo Gong
- et al.
- 2023
- Scientific Reports
First Experimental Demonstration of MRAM Data Scrubbing: 80 Mb MRAM with 40 nm junctions for Last Level Cache Applications
- H. Wu
- V. Katragadda
- et al.
- 2021
- IEDM 2021
Resistive Memory Process Optimization for High Resistance Switching Toward Scalable Analog Compute Technology for Deep Learning
- Youngseok Kim
- Soon-Cheon Seo
- et al.
- 2021
- IEEE Electron Device Letters
A 14 nm embedded STT-MRAM CMOS technology
- Daniel C. Edelstein
- M. Rizzolo
- et al.
- 2020
- IEDM 2020
Role of high aspect-ratio thin-film metal deposition in Cu back-end-of-line technology
- Andrew Simon
- O. Van Der Straten
- et al.
- 2020
- JVSTA
Exploring the Limits of Cobalt Liner Thickness in Advanced Copper Interconnects
- Nicholas A. Lanzillo
- Kisik Choi
- et al.
- 2019
- IEEE Electron Device Letters