PEALD Ru liner conformality and Cu trench fill characteristics
- O. Van Der Straten
- J. Wynne
- et al.
- 2008
- ECS Meeting 2008
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33 results for O. Van Der Straten
Metal-organic atomic layer deposition of metals for applications in interconnect technology
- O. Van Der Straten
- S.M. Rossnagel
- et al.
- 2005
- ECS Meeting 2005
Robust TaN x diffusion barrier for Cu-interconnect technology with subnanometer thickness by metal-organic plasma-enhanced atomic layer deposition
- H. Kim
- C. Detavenier
- et al.
- 2005
- Journal of Applied Physics