Enhanced via integration process for copper/ultralow-κ interconnects
- C.-C. Yang
- F. Chen
- et al.
- 2010
- IEEE Electron Device Letters
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60 results for Baozhen Li
ALD TaN barrier for enhanced performance with low contact resistance for 14 nm Technology Node Cu Interconnects
- Joyeeta Nag
- Brian A. Cohen
- et al.
- 2015
- ECS Meeting 2015 Phoenix
A Flexible and Inherently Self-Consistent Methodology for MOL/BEOL/MIMCAP TDDB Applications with Excessive Variability-Induced Degradation
- Ernest Wu
- Ron Bolam
- et al.
- 2022
- IRPS 2022
Quantum Mechanical Connection of Schottky Emission Process and Its implications on Breakdown Methodology and Conduction Modeling for BEOL Low-k Dielectrics
- Ernest Wu
- Baozhen Li
- 2022
- IRPS 2022
Comprehensive Methodology for Multiple Spots Competing Progressive Breakdown for BEOL/FEOL Applications
- Ernest Wu
- Baozhen Li
- et al.
- 2019
- IRPS 2019
Elapsed-time statistics of successive breakdown in the presence of variability for dielectric breakdown in BEOL/MOL/FEOL applications
- Ernest Y. Wu
- Andrew Kim
- et al.
- 2018
- IRPS 2018
Electromigration characteristics of power grid like structures
- Baozhen Li
- Andrew Kim
- et al.
- 2018
- IRPS 2018
A stochastic model for impact of LER on BEOL TDDB
- Ramachandran Muralidhar
- Ernest Y. Wu
- et al.
- 2017
- IRPS 2017
A new and holistic modelling approach for impact of line-edge roughness on dielectric reliability
- Ernest Y. Wu
- Ramachandran Muralidhar
- et al.
- 2017
- IRPS 2017
Time-dependent series resistance and implications for voltage acceleration models in BEOL TDDB
- Andrew Kim
- Baozhen Li
- et al.
- 2016
- IRPS 2016