Integrated non-SO 2 underlayer and improved line-edge-roughness dielectric etch process using 193 nm bilayer resist
- Parijat Bhatnagar
- Siddhartha Panda
- et al.
- 2006
- Applied Physics Letters
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14 results for Rich Wise
Etching silicon-containing bilayer resists in ammonia-based plasmas
- Siddhartha Panda
- Richard Wise
- et al.
- 2005
- Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Tunable anti-reflective coatings with built-in hard mask properties facilitating thin resist processing
- Arpan P. Mahorowala
- Katherina Babich
- et al.
- 2001
- Proceedings of SPIE - The International Society for Optical Engineering
Plasma-etching processes for ULSI semiconductor circuits
- M. Armacost
- P.D. Hoh
- et al.
- 1999
- IBM J. Res. Dev