Optimization of pitch-split double patterning phoresist for applications at the 16nm node
- Steven J. Holmes
- Cherry Tang
- et al.
- 2011
- ASMC 2011
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15 results for Mark Slezak
Optimization of pitch-split double patterning photoresist for applications at the 16nm node
- Steven J. Holmes
- Cherry Tang
- et al.
- 2011
- SPIE Advanced Lithography 2011
Fabrication of dual damascene BEOL structures using a multi-level multiple exposure (MLME) scheme - Part 2. RIE-based pattern transfer and completion of dual damascene process yielding an electrically functional via chain
- Stefan Harrer
- John C Arnold
- et al.
- 2010
- Proceedings of SPIE - The International Society for Optical Engineering 2010
Process characterization of pitch-split resist materials for application at 16nm node
- Steven J. Holmes
- Cherry Tang
- et al.
- 2010
- Proceedings of SPIE - The International Society for Optical Engineering 2010
Fabrication of dual damascene BEOL structures using a Multi-Level Multiple Exposure (MLME) scheme - Part 1. Lithographic patterning
- Dario L. Goldfarb
- Stefan Harrer
- et al.
- 2010
- Proceedings of SPIE - The International Society for Optical Engineering 2010
Building an immersion top coat from the ground up - Materials perspective
- Mahmoud Khojasteh
- Irene Popova
- et al.
- 2007
- SPIE Advanced Lithography 2007
High performance 193nm photoresists based on fluorosulfonamide
- Wenjie Li
- Kuang-Jung Chen
- et al.
- 2007
- SPIE Advanced Lithography 2007
Progress towards developing high performance immersion compatible materials and processes
- Karen Petrillo
- Kaushal Patel
- et al.
- 2005
- Microlithography 2005
193nm single layer photoresists: Defeating tradeoffs with a new class of fluoropolymers
- P.R. Varanasi
- R.W. Kwong
- et al.
- 2005
- Microlithography 2005
IBM-JSR 193nm negative tone resist: Polymer design, material properties, and lithographic performance
- Kaushal Patel
- Margaret Lawson
- et al.
- 2004
- Microlithography 2004