Coupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systems
- Biancun Xie
- Madhavan Swaminathan
- et al.
- 2011
- EMC 2011
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7 results for Madhavan Swaminathan
Electrical-thermal co-analysis for power delivery networks in 3D system integration
- Jianyong Xie
- Daehyun Chung
- et al.
- 2009
- 3DIC 2009
Effect of system components on electrical and thermal characteristics for power delivery networks in 3D system integration
- Jianyong Xie
- Daehyun Chung
- et al.
- 2009
- EPEPS 2009
Dielectric anisotropy of BPDA-PDA polyimide and its effect on electrical characteristics of interconnects
- A. Deutsch
- M. Swaminathan
- et al.
- 1993
- IEEE Topical Meeting EPEPS 1993
Rigorous electrical modeling of through silicon vias (TSVs) with MOS capacitance effects
- Tapobrata Bandyopadhyay
- Ki Jin Han
- et al.
- 2011
- IEEE Transactions on CPMT
Electromagnetic modeling of through-silicon via (TSV) interconnections using cylindrical modal basis functions
- Ki Jin Han
- Madhavan Swaminathan
- et al.
- 2010
- IEEE Transactions on Advanced Packaging
Surface Integral Formulation for Calculating Conductor and Dielectric Losses of Various Transmission Structures
- Tanmoy Roy
- Tapan K. Sarkar
- et al.
- 1995
- IEEE T-MTT