Analysis and optimization of low-power passive equalizers for cpu-memory links
- Ling Zhang
- Wenjian Yu
- et al.
- 2011
- IEEE Transactions on CPMT
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Prediction and comparison of high-performance on-chip global interconnection
- Yulei Zhang
- Xiang Hu
- et al.
- 2011
- IEEE Transactions on VLSI Systems
A thermal simulation process based on electrical modeling for complex interconnect, packaging, and 3DI structures
- Lijun Jiang
- Chuan Xu
- et al.
- 2010
- IEEE Transactions on Advanced Packaging
Electrical modelling of temperature distributions in on-chip interconnects, packaging, and 3D integration
- Lijun Jiang
- Chuan Xu
- et al.
- 2010
- APEMC 2010
Application of the short-pulse propagation technique for broadband characterization of PCB and other interconnect technologies
- Alina Deutsch
- Roger S. Krabbenhoft
- et al.
- 2010
- IEEE Trans Electromagn Compat
Electrical-thermal co-analysis for power delivery networks in 3D system integration
- Jianyong Xie
- Daehyun Chung
- et al.
- 2009
- 3DIC 2009
The effects of time windowing on the accuracy of the short-pulse propagation technique
- Lionelle F. Wells
- Alina Deutsch
- et al.
- 2009
- EPEPS 2009
Effect of system components on electrical and thermal characteristics for power delivery networks in 3D system integration
- Jianyong Xie
- Daehyun Chung
- et al.
- 2009
- EPEPS 2009
Prediction of high-performance on-chip global interconnection
- Yulei Zhang
- Xiang Hu
- et al.
- 2009
- SLIP 2009
Fast 3-D thermal analysis of complex interconnect structures using electrical modeling and simulation methodologies
- Chuan Xu
- Lijun Jiang
- et al.
- 2009
- ICCAD 2009