Quasiparticle tunneling as a probe of Josephson junction barrier and capacitor material in superconducting qubits
- C. Kurter
- Conal E. Murray
- et al.
- 2022
- npj Quantum Information
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21 results for Adam Pyzyna
Thin film deposition research and its impact on microelectronics scaling
- Cyril Cabral
- Christian Lavoie
- et al.
- 2020
- JVSTA
Resistivity of copper interconnects at 28 nm pitch and copper cross-sectional area below 100 nm2
- Adam Pyzyna
- Hsinyu Tsai
- et al.
- 2017
- IITC 2017
CMOS compatible MIM decoupling capacitor with reliable sub-nm EOT high-k stacks for the 7 nm node and beyond
- Takashi Ando
- Eduard Cartier
- et al.
- 2016
- IEDM 2016
Replacement high-K/metal-gate High-Ge-content strained SiGe FinFETs with high hole mobility and excellent SS and reliability at aggressive EOT ∼7Å and scaled dimensions down to sub-4nm fin widths
- Pouya Hashemi
- Takashi Ando
- et al.
- 2016
- VLSI Technology 2016
Resistivity of copper interconnects beyond the 7 nm node
- Adam Pyzyna
- Robert L. Bruce
- et al.
- 2015
- VLSI Technology 2015
Tunable electrical properties of TaNx thin films grown by ionized physical vapor deposition
- Miri Choi
- Catherine Dubourdieu
- et al.
- 2014
- JVSTB
Density scaling with gate-all-around silicon nanowire MOSFETs for the 10 nm node and beyond
- Sarunya Bangsaruntip
- K. Balakrishnan
- et al.
- 2013
- IEDM 2013
Subtractive W contact and local interconnect co-integration (CLIC)
- Fei Liu
- Benjamin Fletcher
- et al.
- 2013
- IITC 2013
SiGe HBTs in 90nm BiCMOS technology demonstrating 300GHz/420GHz f T/fMAX through reduced Rb and Ccb parasitics
- Renata Camillo-Castillo
- Q. Liu
- et al.
- 2013
- BCTM 2013