Reliability of Cu interconnects with Ta implant
- J.P. Gambino
- T.D. Sullivan
- et al.
- 2007
- IITC 2007
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126 results for Ken Rodbell
Metal-organic atomic layer deposition of metals for applications in interconnect technology
- O. Van Der Straten
- S.M. Rossnagel
- et al.
- 2005
- ECS Meeting 2005
Several issues regarding the nanopore structure in low-dielectric-constant films detected by positron annihilation lifetime spectroscopy
- C.L. Wang
- M.H. Weber
- et al.
- 2003
- Radiation Physics and Chemistry
Radiation effects in low dielectric constant methyl-silsesquioxane films
- Mihail P. Petkov
- Kelvin G. Lynn
- et al.
- 2002
- IEEE TNS
Crystallographic texture and phase metrology during damascene copper processing
- K.J. Kozaczek
- P. DeHaven
- et al.
- 2002
- MRS Proceedings 2002
Characteristics of low-k and ultralow-k PECVD deposited SiCOH films
- A. Grill
- V.V. Patel
- et al.
- 2002
- MRS Proceedings 2002
Texture evolution in Al(Cu) interconnect materials
- C.E. Murray
- K.P. Rodbell
- 2001
- MRS Proceedings 2001
Effects of texture, microstructure, and alloy content on electromigration of aluminum-based metallization
- D.B. Knorr
- K.P. Rodbell
- 1992
- SPIE Microelectronic Processing 1992
Effect of annealing on the Cu distribution and Al2Cu precipitation in Al(Cu) thin films
- E.G. Colgan
- K.P. Rodbell
- et al.
- 1993
- MRS Proceedings 1993
Elecromigration damage in fine Al alloy lines due to interfacial diffusion
- C.-K. Hu
- M.B. Small
- et al.
- 1993
- MRS Proceedings 1993