Injection Molded Solder IMS for Fluxless Lead-free Solder Bumping of Decoupling Capacitor Package
- Peter A. Gruber
- Minkailu A. Jalloh
- et al.
- 2001
- Advances in Electronic Packaging 2001
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13 results for Peter A. Gruber
An overview of Pb-free, flip-chip wafer-bumping technologies
- Sung K. Kang
- Peter Gruber
- et al.
- 2008
- JOM
Low-cost wafer bumping
- Peter A. Gruber
- Luc Bélanger
- et al.
- 2005
- IBM J. Res. Dev