Mask and mask-less injection molded solder (IMS) technology for fine pitch substrate bumping
- Jae-Woong Nah
- Peter A. Gruber
- et al.
- 2010
- IMAPS 2010
Publications
Date
Featured collections
Popular topics
13 results for Peter A. Gruber
Injection molded solder - a new fine pitch substrate bumping method
- Jae-Woong Nah
- Peter A. Gruber
- et al.
- 2009
- ECTC 2009
An overview of Pb-free, flip-chip wafer-bumping technologies
- Sung K. Kang
- Peter Gruber
- et al.
- 2008
- JOM
C4NP for Pb-free solder wafer bumping and 3D fine-pitch applications
- D.Y. Shih
- B. Dang
- et al.
- 2008
- ICEPT-HDP 2008
50μm pitch Pb-free micro-bumps by C4NP technology
- Bing Dang
- Da-Yuan Shih
- et al.
- 2008
- ECTC 2008
C4NP Cu-cored Pb-free flip chip interconnections
- Jae-Woong Nah
- Stephen L. Buchwalter
- et al.
- 2008
- ECTC 2008
C4NP - IBM manufacturing & reliability data for lead free flip chip solder bumping
- Klaus Ruhmer
- Eric Laine
- et al.
- 2006
- IMPACT 2006
C4NP - First manufacturing & reliability data for high-end FlipChip solder bumping based on IBM's C4NP process
- Klaus Ruhmer
- Eric Laine
- et al.
- 2006
- GBC 2006
Low-cost wafer bumping
- Peter A. Gruber
- Luc Bélanger
- et al.
- 2005
- IBM J. Res. Dev
Injection molded solder technology for Pb-free wafer bumping
- P. Gruber
- D.Y. Shih
- et al.
- 2004
- ECTC 2004