The use of accelerated full-wave modeling to analyze power island coupling in a hyperBGA SCM
- Jason Morsey
- Alina Deutsch
- et al.
- 2007
- IEEE Transactions on Advanced Packaging
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64 results for Barry J. Rubin
The use of fast integral equations solvers for practical package and interconnect analysis
- J.D. Morsey
- Barry J. Rubin
- et al.
- 2006
- IEEE Topical Meeting EPEPS 2006
Novel capacitance extraction method using direct boundary integral equation method and hierarchical approach
- L. Jiang
- Barry J. Rubin
- et al.
- 2006
- IEEE Topical Meeting EPEPS 2006
Principles for physical-based gridding of package structures
- Barry J. Rubin
- 2006
- IEEE Topical Meeting EPEPS 2006
Electrical considerations for interconnections inside a computer
- G. Arjavalingam
- Barry J. Rubin
- 2006
- Fiber and Integrated Optics
New methodology for combined simulation of delta-I noise interaction with interconnect noise for wide, on-chip data-buses using lossy transmission-line power-blocks
- Alina Deutsch
- Howard H. Smith
- et al.
- 2006
- IEEE Transactions on Advanced Packaging
IBM Intelligent Bricks project - Petabytes and beyond
- Winfried W. Wilcke
- Robert B. Garner
- et al.
- 2006
- IBM J. Res. Dev
The use of accelerated full-wave modeling to analyze power island coupling in a HyperBGA SCM
- J.D. Morsey
- A. Deutsch
- et al.
- 2005
- IEEE Topical Meeting EPEPS 2005
Understanding how to model difficult features and related physical effects in electrical packages
- Barry J. Rubin
- 2005
- IEEE Topical Meeting EPEPS 2005
Efficient modeling methodology and hardware validation of glass-ceramic based wiring for high-performance single- And multi-chip modules
- Sungjun Chun
- Anand Haridass
- et al.
- 2005
- ECTC 2005