Use of the SPP technique to account for inhomogeneities in differential printed-circuit-board wiring
- A. Deutsch
- Roger Krabbenhoft
- et al.
- 2008
- SPI 2008
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64 results for Barry J. Rubin
Electromagnetic simulation for inhomogeneous interconnect and packaging structures
- Lijun Jiang
- Barry J. Rubin
- et al.
- 2007
- IEEE Topical Meeting EPEPS 2007
The use of fast integral equations solvers for practical package and interconnect analysis
- J.D. Morsey
- Barry J. Rubin
- et al.
- 2006
- IEEE Topical Meeting EPEPS 2006
Novel capacitance extraction method using direct boundary integral equation method and hierarchical approach
- L. Jiang
- Barry J. Rubin
- et al.
- 2006
- IEEE Topical Meeting EPEPS 2006
Principles for physical-based gridding of package structures
- Barry J. Rubin
- 2006
- IEEE Topical Meeting EPEPS 2006
The use of accelerated full-wave modeling to analyze power island coupling in a HyperBGA SCM
- J.D. Morsey
- A. Deutsch
- et al.
- 2005
- IEEE Topical Meeting EPEPS 2005
Understanding how to model difficult features and related physical effects in electrical packages
- Barry J. Rubin
- 2005
- IEEE Topical Meeting EPEPS 2005
A CAD methodology and tool for the characterization of wide on-chip buses
- I.M. Elfadel
- A. Deutsch
- et al.
- 2004
- DATE 2004
Methodology to simulate delta-I noise interaction with interconnect noise for wide, on-chip data-buses using lossy transmission-line power-blocks
- A. Deutsch
- H. Smith
- et al.
- 2004
- IEEE Topical Meeting EPEPS 2004
Extraction of ε(f) and tan δ(f) for BT Insulator up to 30 GHz Using the Short-Pulse Propagation Technique
- A. Deutsch
- T.-M. Winkel
- et al.
- 2003
- IEEE Topical Meeting EPEPS 2003