Micro lens array assembly for optical organic substrate
- Patrick Jacques
- Richard Langlois
- et al.
- 2019
- ECTC 2019
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11 results for Richard Langlois
Solder-Reflowable, High-Throughput Fiber Assembly Achieved by Partitioning of Adhesive Functions
- Alexander Janta-Polczynski
- Elaine Cyr
- et al.
- 2018
- ECTC 2018
Optoelectronic Chip Assembly Process of Optical MCM
- Masao Tokunari
- Koji Masuda
- et al.
- 2017
- ECTC 2017
Thermo-Compression Bonding and Mass Reflow Assembly Processes of 3D Logic Die Stacks
- Pascale Gagnon
- Christian Bergeron
- et al.
- 2017
- ECTC 2017
Bonding technologies for chip level and wafer level 3D integration
- Katsuyuki Sakuma
- Spyridon Skordas
- et al.
- 2014
- ECTC 2014
Delamination mechanisms of thermal interface materials in organic packages during reflow and moisture soaking
- Jiantao Zheng
- Virendra Jadhav
- et al.
- 2009
- ECTC 2009
Self-Aligned Polymeric Fiber Interface with 20/mm Port Density and 1.1 dB O-Band Loss
- Alexander Janta-Polczynski
- Tymon Barwicz
- et al.
- 2020
- ECOC 2020
Solder-reflowable single-mode fiber array photonics assembly in high-throughput manufacturing facilities
- Alexander Janta-Polczynski
- Elaine Cyr
- et al.
- 2019
- SPIE OPTO 2019
Compliant Polymer Interface Demonstration with Standard Plug-In Connection to Fiber Cables
- Tymon Barwicz
- Kengo Watanabe
- et al.
- 2018
- IPC 2018
Towards co-packaging of photonics and microelectronics in existing manufacturing facilities
- Alexander Janta-Polczynski
- Elaine Cyr
- et al.
- 2018
- SPIE OPTO 2018