Improved connectorization of compliant polymer waveguide ribbon for silicon nanophotonics chip interfacing to optical fibers
- Yoichi Taira
- Hidetoshi Numata
- et al.
- 2015
- ECTC 2015
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18 results at ECTC 2015
Dual-side cooling for a three-dimensional (3D) chip stack : Additional cooling from the laminate (substrate) side
- Keiji Matsumoto
- Hiroyuki Mori
- et al.
- 2015
- ECTC 2015
Novel mass reflow method for organic substrates
- Vijay D. Khanna
- Sri M. Sri-Jayantha
- 2015
- ECTC 2015
A multilayer organic package with four integrated 60GHz antennas enabling broadside and end-fire radiation for portable communication devices
- Xiaoxiong Gu
- Duixian Liu
- et al.
- 2015
- ECTC 2015
Simulation of thermal pulse evolution during laser debonding
- Bucknell Webb
- Paul Andry
- 2015
- ECTC 2015
Nanoparticle assembly and sintering towards all-copper flip chip interconnects
- Jonas Zürcher
- Kerry Yu
- et al.
- 2015
- ECTC 2015
Automated, self-aligned assembly of 12 fibers per nanophotonic chip with standard microelectronics assembly tooling
- Tymon Barwicz
- Nicolas Boyer
- et al.
- 2015
- ECTC 2015
Flip chip assembly with sub-micron 3D re-alignment via solder surface tension
- Jae Woong Nah
- Yves Martin
- et al.
- 2015
- ECTC 2015