Planarity-tolerant fine-pitch reworkable interconnections with sharp protrusions and microbumps
- Y. Liu
- Steven L. Wright
- et al.
- 2015
- ECTC 2015
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18 results at ECTC 2015
Organic Multi-Chip Module for high performance systems
- Lei Shan
- Young Kwark
- et al.
- 2015
- ECTC 2015
An enhanced thermo-compression bonding process to address warpage in 3D integration of large die on organic substrates
- Katsuyuki Sakuma
- Krishna Tunga
- et al.
- 2015
- ECTC 2015
Influence of UBM metallurgy on Sn textures and em failure
- Minhua Lu
- Hongqing Zhang
- 2015
- ECTC 2015
Silicon photonics packaging for highly scalable optical interconnects
- Antonio La Porta
- Jonas Weiss
- et al.
- 2015
- ECTC 2015
Through silicon via process for effective multi-wafer integration
- Akihiro Horibe
- Kuniaki Sueoka
- et al.
- 2015
- ECTC 2015
Electromigration and thermal migration in Pb-free interconnects
- Minhua Lu
- Thomas Wassick
- et al.
- 2015
- ECTC 2015
Embedded power insert enabling dual-side cooling of microprocessors
- Thomas Brunschwiler
- Dominic Gschwend
- et al.
- 2015
- ECTC 2015
Semiconductor optical amplifier (SOA) packaging for scalable and gain-integrated silicon photonic switching platforms
- Russell A. Budd
- Laurent Schares
- et al.
- 2015
- ECTC 2015
Defect mitigation of plasma-induced delamination of TiW/Cu from SiNx layer in thin si interposer processing with glass carriers
- Vijay Sukumaran
- Thuy Tran-Quinn
- et al.
- 2015
- ECTC 2015