Thermal and electromigration-induced strains in copper conductor lines: X-ray microbeam measurements and analysis
- G. Wang
- H. Zhang
- et al.
- 2006
- MRS Spring Meeting 2006
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14288 results for Physical Sciences
Effects of BEOL stack on thermal mechanical stress of Cu lines
- Seung-Hyun Rhee
- Conal E. Murray
- et al.
- 2006
- MRS Spring Meeting 2006
Systematic characterization of pseudomorphic (110) intrinsic SiGe epitaxial films for hybrid orientation technology with embedded SiGe source/drain
- Qiqing Ouyang
- Anita Madan
- et al.
- 2006
- MRS Spring Meeting 2006
Characterization of HfO2/Si exposed to water vapor at room temperature
- Carlos Driemeier
- Elizandra Martinazzi
- et al.
- 2006
- MRS Spring Meeting 2006
Control of interfacial structure and electrical properties in MBE grown single crystalline SrTiO3 gate dielectrics on Si(100)
- Gerd Norga
- Chiara Marchiori
- et al.
- 2006
- MRS Spring Meeting 2006
A comparison of electrical and physical properties of MOCVD hafnium silicate thin films deposited using various silicon precursors
- P. Jamison
- M. Copel
- et al.
- 2006
- MRS Spring Meeting 2006
Nanoporous materials integration into advanced microprocessors
- E. Todd Ryan
- Cathy Labelle
- et al.
- 2005
- MRS Spring Meeting 2005
Synchrotron X-ray micro-diffraction analysis on microstructure evolution in Sn under electromigratton
- Albert T. Wu
- N. Tamura
- et al.
- 2005
- MRS Spring Meeting 2005
Systematic study of workfunction engineering and scavenging effect using NiSi alloy FUSI metal gates with advanced gate stacks
- Y.-H. Kim
- C. Cabral Jr.
- et al.
- 2005
- IEDM 2005
Interconnect Issues post 45nm
- S.M. Rossnagel
- Robert L. Wisnieff
- et al.
- 2005
- IEDM 2005