Electrochemical process for advanced package fabricationS. KrongelbL. Romankiwet al.1998IBM J. Res. Dev
Evaluation of Al(Nd)-alloy films for application to thin-film-transistor liquid crystal displaysH. TakatsujiE.G. Colganet al.1998IBM J. Res. Dev
Future directions in electroplated materials for thin-film recording headsP.C. AndricacosN. Robertson1998IBM J. Res. Dev
Damascene copper electroplating for chip interconnectionsP.C. AndricacosC. Uzohet al.1998IBM J. Res. Dev
Thin-film-transistor process-characterization test structuresE.G. ColganR.J. Polastreet al.1998IBM J. Res. Dev
Magnetic properties of transition-metal multilayers studied with X-ray magnetic circular dichroism spectroscopyJ. StöhrR. Nakajima1998IBM J. Res. Dev