Design intent optimization at the beyond 7nm node: The intersection of DTCO and EUVL stochastic mitigation techniques
- Michael Crouse
- L. Liebmann
- et al.
- 2017
- SPIE Advanced Lithography 2017
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23 results at SPIE Advanced Lithography 2017
Identification and sensitivity analysis of a correlated ground rule system (design arc)
- Eric Eastman
- Dureseti Chidambarrao
- et al.
- 2017
- SPIE Advanced Lithography 2017
Overlay statistics for multiple exposure patterning
- 2017
- SPIE Advanced Lithography 2017
Decomposition of the TCC using non-coherent kernels for faster calculation of lithographic images
- Alan E. Rosenbluth
- 2017
- SPIE Advanced Lithography 2017
DSA patterning options for logics and memory applications
- Chi Chun Liu
- Elliott Franke
- et al.
- 2017
- SPIE Advanced Lithography 2017
Electrical study of DSA shrink process and CD rectification effect at sub-60nm using EUV test vehicle
- Cheng Chi
- Chi Chun Liu
- et al.
- 2017
- SPIE Advanced Lithography 2017
Advanced fast 3D DSA model development and calibration for design technology co-optimization
- Kafai Lai
- Balint Meliorisz
- et al.
- 2017
- SPIE Advanced Lithography 2017
Driving down defect density in composite EUV patterning film stacks
- Luciana Meli
- Karen Petrillo
- et al.
- 2017
- SPIE Advanced Lithography 2017
An OCD perspective of line edge and line width roughness metrology
- Ravi Bonam
- R. Muthinti
- et al.
- 2017
- SPIE Advanced Lithography 2017
Ultrathin EUV patterning stack using polymer brush as an adhesion promotion layer
- Indira Seshadri
- Anuja De Silva
- et al.
- 2017
- SPIE Advanced Lithography 2017