Integration and Packaging of Embedded Radial Micro-Channels for 3D Chip Cooling
- Bing Dang
- Evan Colgan
- et al.
- 2016
- ECTC 2016
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13 results at ECTC 2016
Solder Injected through Via for Multi Stacked Wafers
- Akihiro Horibe
- Kuniaki Sueoka
- et al.
- 2016
- ECTC 2016
A Four-Channel Silicon Photonic Carrier with Flip-Chip Integrated Semiconductor Optical Amplifier (SOA) Array Providing >10-dB Gain
- Fuad Doany
- Russell A. Budd
- et al.
- 2016
- ECTC 2016
Toward High-Yield 3D Self-Alignment of Flip-Chip Assemblies via Solder Surface Tension
- Yves Martin
- Jae Woong Nah
- et al.
- 2016
- ECTC 2016
Scalable Optical Coupling between Silicon Photonics Waveguides and Polymer Waveguides
- Antonio La Porta
- Roger Dangel
- et al.
- 2016
- ECTC 2016
Fluxless Bonding Process Using Thermo-Compression Micro-Scrub for 61 μm Pitch SnAg Solder 3-D Interconnections
- Katsuyuki Sakuma
- Bucknell Webb
- et al.
- 2016
- ECTC 2016
All-Copper Flip Chip Interconnects by Pressureless and Low Temperature Nanoparticle Sintering
- Jonas Zürcher
- Luca Del Carro
- et al.
- 2016
- ECTC 2016
3Di DC-DC Buck Micro Converter with TSVs, Grind Side Inductors, and Deep Trench Decoupling Capacitors in 32nm SOI CMOS
- J. Safran
- Giri N. K. Rangan
- et al.
- 2016
- ECTC 2016
Novel Low Cost Bumping Process with Non-strip Type Photosensitive Resin and Injection Molded Solder (IMS) for Fine Pitch Flip Chip Joining
- Toyohiro Aoki
- Takashi Hisada
- et al.
- 2016
- ECTC 2016
Proposal of Package Structure Requirements for Effective Cooling from the Bottom Side of Chips (from the Substrate Side), Aiming for a Three-Dimensional (3D) Chip Stack
- Keiji Matsumoto
- Hiroyuki Mori
- 2016
- ECTC 2016