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52 results for Chiplets

High resolution patterning of positive resist for semi-additive process
- - Elizabeth A. Duch
  - Minhua Lu
  - et al.
- 2025
- SPIE Advanced Lithography + Patterning 2025
Multi-reticle stitching: Applications from packaging to High-NA EUV
- - Chris Bottoms
  - Rick Johnson
  - et al.
- 2025
- SPIE Advanced Lithography + Patterning 2025
Learn more about our Chiplet and Packaging work
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AFM Assisted Hybrid Bonding Interface Optimization
- - Nick Polomoff
  - Jennifer Fullam
  - et al.
- 2025
- SPIE Advanced Lithography + Patterning 2025
D2W and W2W Hybrid bonding system with below 2.5 micron pitch for 3D chiplet AI applications
- - Katsuyuki Sakuma
  - Roy Yu
  - et al.
- 2024
- IEDM 2024
A NRZ/PAM4 SST TX in 5nm FinFET CMOS with 3-tap FFE and 0.7pJ/b efficiency at 100 Gb/s PAM4
- - Marcel Kossel
  - Matthias Brandli
  - et al.
- 2024
- ESSERC 2024
A 40 GS/s 8b-DAC SST-TX in 7 nm FinFET CMOS for cryogenic quantum applications with 32kB SRAM-based RF-DDS AWG
- - Marcel Kossel
  - Matthias Brändli
  - et al.
- 2024
- ESSERC 2024
AI chiplets in an open ecosystem: barriers and solution approaches
- - Daniel Friedman
- 2024
- DAC 2024
A Scalable Heterogeneous AiP Module for a 256-Element 5G Phased Array
- - Alberto Valdes Garcia
- 2024
- IMS 2024
A Microstructural Investigation of Sub-1 μm Copper Bonding Contact Structures in Die-to-Wafer Hybrid Bonding
- - Sari Zerey
  - Junghyun Cho
  - et al.
- 2024
- ECTC 2024
Effect of Micro-channel Cross-section and Coolant Pressure on Two-Phase Cooling
- - Pritish Parida
- 2024
- ITherm 2024