HJHemanth JagannathanIBM Distinguished Engineer - Chiplet and Advanced Packaging Technology & Quantum 300mm Scale-out
IAIshtiaq AhsanSenior Manager, Yield/ Test & Characterization, IBM Semiconductor Technology Research & Development
VNVijay NarayananIBM Fellow & Senior Manager, Materials Innovation for Logic & Chiplets, Analog AI Compute
Advanced logic technology at 2nm nodePlatform technology research: innovation and solution creation for leading edge CMOS technology at 2nm node.
The American Semiconductor Innovation CoalitionIBM is a founding member of ASIC, a diverse group united to advocate for U.S. semiconductor leadership.
Blog PostCopper evolution and beyond: Developments in advanced interconnects for future CMOS nodesIBM Research Blog13 Dec 2024
Blog PostCo-packaged optics deliver high-speed connectivity to supercharge generative AI computingIBM Research Blog09 Dec 2024
Blog PostRemembering Bob Dennard, inventor of the chip that changed the worldIBM Research Blog10 Jun 2024
Blog PostIBM, Canada, and Quebec are partnering to secure the future of chipmaking in North AmericaIBM Research Blog26 Apr 2024
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