Evan Colgan

Title

Research Staff Member

Bio

Evan G. Colgan received a BS in Applied Physics from Caltech in 1982 and a PhD in Materials Science from Cornell in 1987. Dr. Colgan joined IBM, East Fishkill, NY in 1987 and worked on silicides, selective CVD-W, diffusion barriers, and both Cu- and Al-based chip wiring. He transferred to IBM Research as a Research Staff Member in 1995 to manage the TFT Processing Department and subsequently worked on a number of display-related projects, including a LCoS projection display. He joined the Packaging Area in 2001 and has worked on optical packaging, 2.5D and 3D integration, thermal characterization for chip stacks, nanofluidics for DNA translocation, and high-performance liquid cooling. Dr. Colgan was an IBM Master Inventor (2018-2021) and has received five IBM Outstanding Technical Achievement awards and two IBM Outstanding Innovation awards. He has 130 technical publications, 203 issued U.S. patents, and is a member of MRS, Sigma Xi, and a Senior Member of IEEE.

Publications

Nickel suicide thermal stability on polycrystalline and single crystalline silicon
- - E.G. Colgan
  - J.P. Gambino
  - et al.
- 1996
- Materials Chemistry and Physics
The role of Cu distribution and Al₂Cu precipitation on the electromigration reliability of submicrometer Al(Cu) lines
- - E.G. Colgan
  - K.P. Rodbell
- 1994
- Journal of Applied Physics
Kinetics of Al grain growth, Al₂Cu precipitation, and dissolution in blanket thin films and fine lines
- - E.G. Colgan
  - K.P. Rodbell
  - et al.
- 1994
- Journal of Applied Physics
Manufacturability versus reliability issues relevant to interconnect metallizations
- - K.P. Rodbell
  - E.G. Colgan
  - et al.
- 1994
- MRS Spring Meeting 1994
Activation energy for C94 and C54 TiSi₂ formation measured during rapid thermal annealing
- - E.G. Colgan
  - L. Clevenger
  - et al.
- 1994
- Applied Physics Letters
Rapid evaluations of thin film interfacial reactions using temperature-ramped measurements
- - J.M.E. Harper
  - L. Clevenger
  - et al.
- 1993
- MRS Fall Meeting 1993
Effect of annealing on the Cu distribution and Al₂Cu precipitation in Al(Cu) thin films
- - E.G. Colgan
  - K.P. Rodbell
  - et al.
- 1993
- MRS Proceedings 1993

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Patents

- 11 Jan 1994
- US
- 5277985
Process For Fabricating Copper Interconnects In Ultra Large Scale Integrated (ulsi) Circuits
- 22 Jun 1993
- US
- 5221449
Structure And Method Of Making Alpha-ta In Thin Films

Top collaborators

Evan Colgan

Title

Bio

Publications

Nickel suicide thermal stability on polycrystalline and single crystalline silicon

The role of Cu distribution and Al₂Cu precipitation on the electromigration reliability of submicrometer Al(Cu) lines

Kinetics of Al grain growth, Al₂Cu precipitation, and dissolution in blanket thin films and fine lines

Manufacturability versus reliability issues relevant to interconnect metallizations

Activation energy for C94 and C54 TiSi₂ formation measured during rapid thermal annealing

Rapid evaluations of thin film interfacial reactions using temperature-ramped measurements

Effect of annealing on the Cu distribution and Al₂Cu precipitation in Al(Cu) thin films

Patents

Process For Fabricating Copper Interconnects In Ultra Large Scale Integrated (ulsi) Circuits

Structure And Method Of Making Alpha-ta In Thin Films

Top collaborators

Bing Dang

Katsuyuki Sakuma

Bo Wen

Thomas Brunschwiler