Conference paper
High-throughput photonic packaging
Tymon Barwicz, Ted W. Lichoulas, et al.
OFC 2017
We report a fiber-attach solution interfacing self-aligned, standard-cleaved fibers to monolithic photonic integrated circuits, fabricated in Globalfoundries 300-mm CMOS production facilities. Statistical yield analysis and reliability assessment were performed to demonstrate the robustness of the proposed solution.
Tymon Barwicz, Ted W. Lichoulas, et al.
OFC 2017
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ECTC 2017
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ECTC 2016
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OFC 2016