Mark W. Dowley
Solid State Communications
The three-parameter lognormal distribution has been demonstrated for applications in electromigration data analysis, especially for Cu interconnect structures with insufficient redundancy. Examples are given on estimating parameter values from experimental data using the maximum likelihood method. Detailed analyses are presented on confidence bound estimations of the parameters and their propagation to lifetime projections. © 2006.
Mark W. Dowley
Solid State Communications
O.F. Schirmer, W. Berlinger, et al.
Solid State Communications
Joy Y. Cheng, Daniel P. Sanders, et al.
SPIE Advanced Lithography 2008
R. Ghez, J.S. Lew
Journal of Crystal Growth