Min Yang, Jeremy Schaub, et al.
Technical Digest-International Electron Devices Meeting
The three-parameter lognormal distribution has been demonstrated for applications in electromigration data analysis, especially for Cu interconnect structures with insufficient redundancy. Examples are given on estimating parameter values from experimental data using the maximum likelihood method. Detailed analyses are presented on confidence bound estimations of the parameters and their propagation to lifetime projections. © 2006.
Min Yang, Jeremy Schaub, et al.
Technical Digest-International Electron Devices Meeting
Surendra B. Anantharaman, Joachim Kohlbrecher, et al.
MRS Fall Meeting 2020
R.D. Murphy, R.O. Watts
Journal of Low Temperature Physics
Sharee J. McNab, Richard J. Blaikie
Materials Research Society Symposium - Proceedings