Microscopy and Microanalysis

Paper

27 Aug 2014

High energy BSE/SE/STEM imaging of 8 um thick semiconductor interconnects

Abstract

No abstract available.

Paper

Imaging and analysis of subsurface Cu interconnects by detecting backscattered electrons in the scanning electron microscope

L. Gignac, M. Kawasaki, et al.

Journal of Applied Physics

Conference paper

Growth of crystalline defects on the surface of FSG dielectrics

J.P. Gambino, J. Burnham, et al.

AMC 2003

Conference paper

Comparison of electromigration in Cu interconnects with ALD or PVD TaN liners

C.-K. Hu, L. Gignac, et al.

ECS Meeting 2006

Conference paper

A study of electromigration lifetime for Cu interconnects coated with CoWP, Ta/TaN, or SiC _xN _yH _z

C.-K. Hu, D. Canaperi, et al.

AMC 2003

View all publications