K. Barmak, G.A. Lucadamo, et al.
MRS Spring Meeting 1999
During a transient period following deposition, the microstructure of electroplated copper thin films evolve towards larger grain size, different preferred crystallographic texture, and less resistivity, hardness and compressive stress. A model to account for this observation is derived based on grain boundary energy in the fine-grained as-deposited films providing the underlying energy density driving abnormal grain growth. Model predictions describe the mechanisms for the evolution process.
K. Barmak, G.A. Lucadamo, et al.
MRS Spring Meeting 1999
J.M.E. Harper, C. Cabral Jr., et al.
MRS Spring Meeting 1999
V. Narayanan, A.C. Callegari, et al.
VLSI Technology 2004
J.M.E. Harper, D.A. Smith, et al.
MRS Symposium 1985