Conference paper
Implementation challenges for scalable neuromorphic computing
Shintaro Yamamichi, Akihiro Horibe, et al.
VLSI Technology 2017
We investigate a novel Ti Chemical Vapor Deposition (CVD Ti) technique for source/drain and trench contact silicidation. This work is a first demonstration of a highly selective, superconformal Ti process that exhibits a low p-type CVD Ti/SiGe contact resistivity (pc) down to 2.1×10-9 Ω.cm2 (a 40% reduction vs. PVD Ti), matching the lowest published values [1-5]. A competitive n-type CVD Ti/Si
Shintaro Yamamichi, Akihiro Horibe, et al.
VLSI Technology 2017
Shanti Pancharatnam, Gabriel Rodriguez, et al.
IEEE Trans Semicond Manuf
Veeresh Deshpande, Herwig Hahn, et al.
VLSI Technology 2017
Nicolas Breil, Christian Lavoie, et al.
Microelectronic Engineering