Revanth Kodoru, Atanu Saha, et al.
arXiv
This paper investigates and reviews the effects of wafer bow in three- dimensional (3D) integration bonding schemes, including copper wafer bonding and oxide fusion wafer bonding with silicon on insulator (SOI)-based layer transfer technology. Wafer bow criteria for good bonding quality and fabrication techniques to minimize wafer bow are introduced for 3D integration technology and applications. © 2010 TMS.
Revanth Kodoru, Atanu Saha, et al.
arXiv
R.W. Gammon, E. Courtens, et al.
Physical Review B
Hiroshi Ito, Reinhold Schwalm
JES
T.N. Morgan
Semiconductor Science and Technology