Isothermal Aging of Near-Eutectic Sn-Ag-Cu Solder Alloys and Its Effect on Electrical Resistivity
- B.A. Cook
- I.E. Anderson
- et al.
- 2003
- Journal of Electronic Materials
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Effects of Mechanical Deformation and Annealing on the Microstructure and Hardness of Pb-Free Solders
- Paul Lauro
- Sung K. Kang
- et al.
- 2003
- Journal of Electronic Materials
Low-temperature epitaxy of compressively strained silicon directly on silicon substrates
- Davood Shahrjerdi
- Bahman Hekmatshoar
- et al.
- 2011
- Journal of Electronic Materials
Development of conducting adhesive materials for microelectronic applications
- Sung K. Kang
- S. Purushothaman
- 1999
- Journal of Electronic Materials
Study of interfacial reactions between tin and copper by differential scanning calorimetry
- S.K. Kang
- S. Purushothaman
- 1998
- Journal of Electronic Materials
Silicide interfaces in silicon technology
- F.M. D'Heurle
- 1998
- Journal of Electronic Materials
Nanometer-scale studies of nitride/arsenide heterostructures produced by nitrogen plasma exposure of GaAs
- R.S. Goldman
- R.M. Feenstra
- et al.
- 1997
- Journal of Electronic Materials
Low energy ion beam assisted grain size evolution in thin film deposition
- Krishna Rajan
- R.A. Roy
- et al.
- 1997
- Journal of Electronic Materials
Interfacial sliding in Cu/Ta/polyimide high density interconnects as a result of thermal cycling
- D.V. Zhmurkin
- T.S. Gross
- et al.
- 1997
- Journal of Electronic Materials
Crystallographic texture of C54 titanium disilicide as a function of deep submicron structure geometry
- V. Svilan
- K.P. Rodbell
- et al.
- 1997
- Journal of Electronic Materials