K.Z. Zhang, J.N. Greeley, et al.
Journal of Applied Physics
The identification of linear materials for direct electrodeposition of Cu was discussed. Adhesion, recrystallization, texture and resistivity of the plated film were studied. Results showed a family of metals which allow direct Cu electrodeposition in standard acid plating baths.
K.Z. Zhang, J.N. Greeley, et al.
Journal of Applied Physics
A.B. Hall, G.J. Irvine, et al.
Applied Physics Letters
M. Trenary, S.L. Tang, et al.
The Journal of Chemical Physics
F.R. McFeely, L.J. Terminello, et al.
Applied Physics Letters