L.J. Huang, K.K. Chan, et al.
IEEE International SOI Conference 2000
Paper
Liner materials for direct electrodeposition of Cu
Abstract
The identification of linear materials for direct electrodeposition of Cu was discussed. Adhesion, recrystallization, texture and resistivity of the plated film were studied. Results showed a family of metals which allow direct Cu electrodeposition in standard acid plating baths.
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