Liner materials for direct electrodeposition of Cu

M.W. Lane; C.E. Murray; F.R. McFeely; P.M. Vereecken; R. Rosenberg

doi:10.1063/1.1610256

Applied Physics Letters

Paper

15 Sep 2003

Liner materials for direct electrodeposition of Cu

View publication

Abstract

The identification of linear materials for direct electrodeposition of Cu was discussed. Adhesion, recrystallization, texture and resistivity of the plated film were studied. Results showed a family of metals which allow direct Cu electrodeposition in standard acid plating baths.

Conference paper

Thermal cycle reliability of stacked via structures with copper metallization and an organic low-k dielectric

R. Filippi, J.F. McGrath, et al.

IRPS 2004

Paper

An inquiry concerning the principles of Si 2p core-level photoemission shift assignments at the Si/SiO₂ interface

F.R. McFeely

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Paper

C 1s excitation studies of diamond (111). I. Surface core levels

J.F. Morar, F.J. Himpsel, et al.

Physical Review B

Conference paper

HfO ₂/metal stacks: Determination of energy level diagram, work functions & their dependence on metal deposition

S. Zafar, V. Narayanan, et al.

VLSI Technology 2005

View all publications

Abstract

Related

Thermal cycle reliability of stacked via structures with copper metallization and an organic low-k dielectric

An inquiry concerning the principles of Si 2p core-level photoemission shift assignments at the Si/SiO2 interface

C 1s excitation studies of diamond (111). I. Surface core levels

HfO 2/metal stacks: Determination of energy level diagram, work functions & their dependence on metal deposition

An inquiry concerning the principles of Si 2p core-level photoemission shift assignments at the Si/SiO₂ interface

HfO ₂/metal stacks: Determination of energy level diagram, work functions & their dependence on metal deposition