F.R. McFeely, E. Cartier, et al.
Physical Review Letters
The identification of linear materials for direct electrodeposition of Cu was discussed. Adhesion, recrystallization, texture and resistivity of the plated film were studied. Results showed a family of metals which allow direct Cu electrodeposition in standard acid plating baths.
F.R. McFeely, E. Cartier, et al.
Physical Review Letters
S. Malhotra, D. Canaperi, et al.
AMC 2004
M. Copel, P.R. Varekamp, et al.
Applied Physics Letters
L.J. Terminello, F.J. Himpsel, et al.
Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films