Conference paper
High-throughput photonic packaging
Tymon Barwicz, Ted W. Lichoulas, et al.
OFC 2017
Future large scale high performance computing systems will necessitate extensive use of optical interconnects to meet system performance goals, requiring optical interconnects to greatly improve in cost, power, areal density and reliability. Optical printed circuit boards and silicon based integrated photonics are potential technologies to meet these challenges. © 2009 Optical Society of America.
Tymon Barwicz, Ted W. Lichoulas, et al.
OFC 2017
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Shigeru Nakagawa
ACPC 2009
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GFP 2015