Conference paper
High-throughput photonic packaging
Tymon Barwicz, Ted W. Lichoulas, et al.
OFC 2017
Enabling single-mode photonic packaging in high-throughput microelectronic equipment can dramatically improve cost and scalability. We experimentally demonstrate such solution using 12-fiber interfaces and flipped-chip lasers. We measure -1.3dB peak fiber-to-chip transmission.
Tymon Barwicz, Ted W. Lichoulas, et al.
OFC 2017
Yves Martin, Swetha Kamlapurkar, et al.
ECTC 2017
Yves Martin, Jae Woong Nah, et al.
ECTC 2016
Jason S. Orcutt, Douglas M. Gill, et al.
OFC 2016