Lei Shan, Daniel Kuchta, et al.
ECTC 2003
In this paper, the differences in packaging performance between single-ended and differential signaling schemes are studied numerically and validated with measurements. Typical on-board nets were used for the comparisons at various data-rates to capture potential frequency dependencies. Large-scale simulations were performed on full package level to examine the effects of non-ideal ground return on signal integrity. Eye-diagrams and bit-error-rate (BER) were studied using an internal time-domain simulator. An FCPBGA package and a PCB were fabricated and tested to validate simulation results. ©2006 IEEE.
Lei Shan, Daniel Kuchta, et al.
ECTC 2003
Dong G. Kam, Mark B. Ritter, et al.
IEEE Transactions on Advanced Packaging
Sergey Rylov, Scott Reynolds, et al.
IEEE Journal of Solid-State Circuits
S.L. Wright, R.J. Polastre, et al.
ECTC 2006