Passive alignment of optical elements in a printed circuit board
- T. Lamprecht
- F. Horst
- et al.
- 2006
- ECTC 2006
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13 results at ECTC 2006
Packaging considerations for high-speed single-ended and differential nets
- Lei Shan
- Mohit Kapur
- et al.
- 2006
- ECTC 2006
System-on-Package (SOP) technology, characterization and applications
- J. Knickerbocker
- P. Andry
- et al.
- 2006
- ECTC 2006
Characterization of micro-bump C4 interconnects for Si-carrier SOP applications
- S.L. Wright
- R.J. Polastre
- et al.
- 2006
- ECTC 2006
A 60GHz radio chipset fully-integrated in a low-cost packaging technology
- U. Pfeiffer
- J. Gizyb
- et al.
- 2006
- ECTC 2006
Electrical-optical high speed serial server scalability link
- D.N. De Araujo
- M. Cases
- et al.
- 2006
- ECTC 2006
Pb-free micro-joints (50 μm pitch) for the next generation micro-systems: The fabrication, assembly and characterization
- H. Gan
- S.L. Wright
- et al.
- 2006
- ECTC 2006
Optical high speed symmetric multi-processor link implementation
- Daniel Kuchta
- Christian Baks
- et al.
- 2006
- ECTC 2006
MCM LGA package with optical I/O passively aligned to dual layer polymer waveguides in PCB
- Frank R. Libsch
- R. Budd
- et al.
- 2006
- ECTC 2006
Design optimization for isolation in high wiring density packages with high speed SerDes links
- Nju Na
- Jean Audet
- et al.
- 2006
- ECTC 2006