Backward compatible connectors for next generation PCIe electrical I/O
- Lei Shan
- Daniel Freidman
- et al.
- 2018
- ECTC 2018
Publications
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43 results for Lei Shan
Organic Multi-Chip Module for high performance systems
- Lei Shan
- Young Kwark
- et al.
- 2015
- ECTC 2015
Preparing 25Gbps electrical I/O for exascale computing systems
- Lei Shan
- Young Kwark
- et al.
- 2014
- ECTC 2014
Realization of ultra-low power I/O
- Lei Shan
- Timothy Dickson
- et al.
- 2013
- ECTC 2013
Techniques for de-embedding a high port count connector to PCB via interposer
- Yan Ding
- Young H. Kwark
- et al.
- 2011
- ECTC 2011
Layer misregistration in PCB and its effects on signal propagation
- Lei Shan
- Young Kwark
- et al.
- 2010
- ECTC 2010
A study on crosstalk analysis in aggregative transmission lines with turning vias
- Tapobrata Bandyopadhyay
- Lei Shan
- et al.
- 2009
- ECTC 2009
The viability of 25 Gb/s on-board signalling
- Mark B. Ritter
- Petar Pepeljugoski
- et al.
- 2008
- ECTC 2008
Packaging considerations for high-speed single-ended and differential nets
- Lei Shan
- Mohit Kapur
- et al.
- 2006
- ECTC 2006
Design optimization for isolation in high wiring density packages with high speed SerDes links
- Nju Na
- Jean Audet
- et al.
- 2006
- ECTC 2006