PaperSoft x-ray investigation of the effect of growth conditions on InAs/GaAs heterostructuresA. Krol, C.J. Sher, et al.Surface Science
Conference paperCoupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systemsBiancun Xie, Madhavan Swaminathan, et al.EMC 2011
TalkAssessing wildfires hazards around the electric gridFernando Marianno, Wang Zhou, et al.INFORMS 2021
Conference paperFormation mechanism and suppression methods of copper dendrites in BEOL integrationShaoning Yao, Wei-Tsu Tseng, et al.ADMETA 2011
