C.-K. Hu, D. Canaperi, et al.
AMC 2003
The relationship between interfacial adhesion and electromigration in Cu metallization was discussed. The electromigration drift velocity and lifetime in a conventional electromigration was also derived. The results indicated a linear relationship between the electromigration activation energy and the intrinsic work of adhesion.
C.-K. Hu, D. Canaperi, et al.
AMC 2003
X.-H. Liu, T.M. Shaw, et al.
ICEPT 2007
E. Simonyi, K.-W. Lee, et al.
MRS Spring Meeting 1998
D.D. Restaino, Steve Molis, et al.
ADMETA 2007