Materials for strained silicon devices
P.M. Mooney
International Journal of High Speed Electronics and Systems
The minimum epitaxial layer thickness required to produce relaxed, thermally stable, Si0.7Ge0.3 buffer layer structures for high electron- and hole-mobility devices has been determined, using high resolution x-ray diffraction. A 1.4-μm-thick layer, step graded to x=0.35, is sufficiently thick so that the residual strain in a uniform composition Si 0.33Ge0.67 layer grown on top of it is essentially independent of thickness or growth temperature of the layer. Such structures are stable when annealed at 750°C.© 1995 American Institute of Physics.
P.M. Mooney
International Journal of High Speed Electronics and Systems
V. Svilan, K.P. Rodbell, et al.
MRS Spring Meeting 1996
J.L. Jordan-Sweet, P.M. Mooney, et al.
Journal of Applied Physics
N. Caswell, P.M. Mooney, et al.
Applied Physics Letters