Julien Autebert, Aditya Kashyap, et al.
Langmuir
A surface grid assisted charging technique for noncontact e-beam testing of very large scale integrated package substrates has been developed. Successful charging of packages with a variety of combination of conductor/substrate materials (i.e., Au/alumina ceramic, Mo/alumina ceramic, Solder/polyimide, and chromium/polyimide) has been demonstrated using this technique. In this paper, both theoretical and experimental results concerning the role of a surface grid in addressing various testing issues such as package material parameters, charge localization, secondary electron redistribution, local field effect, and the electron detector response characteristic will be discussed.
Julien Autebert, Aditya Kashyap, et al.
Langmuir
Heinz Schmid, Hans Biebuyck, et al.
Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Surendra B. Anantharaman, Joachim Kohlbrecher, et al.
MRS Fall Meeting 2020
Kafai Lai, Alan E. Rosenbluth, et al.
SPIE Advanced Lithography 2007