Interconnects in the third dimension: Design challenges for 3D ICs
- Kerry Bernstein
- Paul Andry
- et al.
- 2007
- DAC 2007
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24 results for David Greenberg
Fundamental power and frequency limits of deeply-scaled CMOS for RF power applications
- Jörg Scholvin
- David R. Greenberg
- et al.
- 2006
- IEDM 2006
Performance and limitations of 65 nm CMOS for integrated RF power applications
- Jörg Scholvin
- David R. Greenberg
- et al.
- 2005
- IEDM 2005
RF power potential of 90 nm CMOS: Device options, performance, and reliability
- Jörg Scholvin
- David R. Greenberg
- et al.
- 2004
- IEDM 2004
Noise performance of a low base resistance 200 GHz SiGe technology
- D.R. Greenberg
- B. Jagannathan
- et al.
- 2002
- IEDM 2002
Manufacturability demonstration of an integrated SiGe HBT technology for the analog and wireless marketplace
- D. Ahlgren
- M.M. Gilbert
- et al.
- 1996
- IEDM 1996
Self-aligned SiGe NPN transistors with 285 GHz f MAX and 207 GHz f T in a manufacturable technology
- B. Jagannathan
- M. Khater
- et al.
- 2002
- IEEE Electron Device Letters
RF characterization and parameter extraction for CMOS device models
- John J. Pekarik
- Basanth Jagannathan
- et al.
- 2007
- SiRF 2007
RF CMOS for microwave and MM-wave applications
- Basanth Jagannathan
- Robert Groves
- et al.
- 2006
- SiRF 2006
Enabling RFCMOS solutions for emerging advanced applications
- John J. Pekarik
- Douglas D. Coolbaugh
- et al.
- 2005
- GAAS 2005