Challenges of nickel silicidation in CMOS technologies
- Nicolas Breil
- Christian Lavoie
- et al.
- 2015
- Microelectronic Engineering
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45 results for M. Chudzik
Post copper CMP hybrid clean process for advanced BEOL technology
- Wei-Tsu Tseng
- Vamsi Devarapalli
- et al.
- 2013
- IEEE Trans Semicond Manuf
Effect of plasma N2 and thermal NH3 nitridation in HfO2 for ultrathin equivalent oxide thickness
- Min Dai
- Yanfeng Wang
- et al.
- 2013
- Journal of Applied Physics
Low resistivity tungsten for 32 nm node MOL contacts and beyond
- Filippos Papadatos
- Keith Wong
- et al.
- 2012
- Microelectronic Engineering
Scaling the MOSFET gate dielectric: From high-k to higher-k? (Invited Paper)
- Martin M. Frank
- SangBum Kim
- et al.
- 2009
- Microelectronic Engineering